Research on Laser Machining of Ceramics Michael F. Modest

Last update: December 5, 1999

Click here for a slideshow of our experiments and models, and here for a somewhat more detailed overview of our theoretical work.

Presently, we are investigating, experimentally as well as theoretically, the occurrence and minimization of thermal stresses during laser machining of ceramics. If you have an mpegviewer, you can view/download several short movies showing the transient development of thermal stresses during laser drilling and scribing:

• CW laser drilling of SiC - temperature and hoop stress development (4.7MB)

• CW laser drilling of SiC - temperature and normal stress development (4.7MB)

• Pulsed laser drilling of SiC, 1st pulse - temperature and hoop stress development (0.9MB)

• Pulsed laser drilling of SiC, 1st pulse - temperature and normal stress development (0.9MB)

• Pulsed laser drilling of SiC, 4th pulse - temperature and hoop stress development (1.3MB)

• Pulsed laser drilling of SiC, 4th pulse -temperature and normal stress development (1.3MB)

• CW laser scribing of SiC - temperature development (3.2MB)

• CW laser scribing of SiC - maximum principal stress development (2.6MB)

• Pulsed laser scribing of SiC , 1 pulse - temperature development (1.9MB)

• Pulsed laser scribing of SiC , 1 pulse - maximum principal stress development (1.9MB)

To understand the meaning of non-dimensional temperatures and non-dimensional stresses used in the above movie clips, check out this Postscript file.